PCB is called “the mother of electronic system products”. As the basic material of electronic products, PCB is occupied by a wide demand market. The downstream applications cover communication, computer, consumer electronics, industrial control medical, automotive electronics, aerospace, etc. Communication and computers are currently the largest application areas of PCBs, accounting for over 25%.
Leap electronic specializes in the production of multi-layer PCB circuit boards. It has accumulated many customers in the field of communication. Leap electronic PCB boards are widely used in wireless networks, transmission networks, data communications, and fixed-line broadband. Related PCB products involve backplanes and high-speed multi-core products. Laminates, high-frequency microwave plates, multi-function metal substrates, etc.
Communication PCB Application and Features
Single- and dual-panel, multi-layer boards with high-frequency TG boards are still the main demand for communication equipment.
It is understood that the global communications PCB market in 2016 reached 14.799 billion US dollars, accounting for 27.3% of the total PCB output value. Among them, the proportion of single and double panels, 4 layers, 6 layers, 8-16 layers, and 18 or more boards were 11.98%, 17.62%, 12.49%, 35.18%, and 7.26%, respectively, and the total proportion reached 84.5%. In 2014, benefiting from the construction of 4G base stations, the global communication PCB output value increased by 5.18% year-on-year, reaching a four-year high. In 2019, 5G will officially enter the commercialization stage, benefiting from 5G, and the future communication PCB is expected to usher in a new round of high growth.
According to industry insiders, in the 5G wireless base station, bearer network, transmission network, core network hardware facilities, the application of PCB hardware will increase significantly. At the same time, 5G terminal equipment, such as mobile phones, smart watches, etc., must also be updated with the communication technology. This part of the PCB requirements is much larger than the infrastructure part.