So, as a PCB design engineer, how should the heat treatment be done?
The heat dissipation of the PCB is related to the selection of the board, the selection of components, and the layout of the components. Among them, the layout plays an important role in the heat dissipation of the PCB, and is the key link of the PCB heat dissipation design. Engineers need to consider the following aspects when making layouts:
(1) Centrally design and install components with high heat and high radiation on another PCB board, so as to perform separate centralized ventilation and cooling to avoid mutual interference with the main board;
(2) The heat capacity of the PCB surface is evenly distributed. Do not place the large power consumption devices in a centralized manner. If it is unavoidable, place the short components upstream of the airflow and ensure that sufficient cooling airflow flows through the heat dissipation concentration zone;
(3) Make the heat transfer path as short as possible;
(4) making the heat transfer cross section as large as possible;
(5) The layout of components should take into account the effects of heat radiation on surrounding components. Heat sensitive parts and components (including semiconductor devices) should be kept away from heat sources or isolated;
(6) Note that forced ventilation is consistent with natural ventilation;
(7) The additional sub-board and device air duct are in the same direction as the ventilation;
(8) Make the intake air and exhaust gas have a sufficient distance as much as possible;
(9) The heat-generating device should be placed as far as possible above the product, and should be on the airflow path if conditions permit;
(10) Do not place the components with large heat or large current on the corners and surrounding edges of the PCB. Install the heat sink as far as possible, and keep away from other devices, and ensure that the heat dissipation channel is unobstructed.
Reminder: Adding a heat sink to the device is also a good way to dissipate heat.