The stencil is also the SMT template. It is an SMT-specific mold whose main function is to help deposit the solder paste. The purpose is to transfer the exact amount of solder paste to the exact position on the empty FPC flexible circuit board. According to the manufacturing process of SMT steel mesh, it can be divided into: laser template, electropolishing template, electroforming template, ladder template, bonding template, nickel plating template, etching template.
FPC stencil is a large number of SMD ICs on FPC flexible circuit boards. Before soldering, it is necessary to brush solder paste on the pads of SMD components. This requires a stencil, each tiling pad on the steel mesh. Open a hole in the position, so when the machine uses the brush to solder paste, all the holes will have solder paste leaking onto the FPC flexible circuit board, then the components will be attached, and finally the reflow soldering machine. As long as you have patch components on your FPC flexible circuit board, you need to make a steel mesh